Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders

Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders

10.1109/EPTC.2009.5416539

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Bibliographic Details
Main Authors: Chandra Rao, B.S.S., Mohan Kumar, K., Zeng, K.Y., Tay, A.A.O., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Lead-free composite solders
Strain hardening exponent
Strain rate
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85944
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Institution: National University of Singapore
Description
Summary:10.1109/EPTC.2009.5416539

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