Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders
10.1109/EPTC.2009.5416539
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Main Authors: | Chandra Rao, B.S.S., Mohan Kumar, K., Zeng, K.Y., Tay, A.A.O., Kripesh, V. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85944 |
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Institution: | National University of Singapore |
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