Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders
10.1109/EPTC.2009.5416539
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2014
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sg-nus-scholar.10635-859442023-10-26T09:05:20Z Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders Chandra Rao, B.S.S. Mohan Kumar, K. Zeng, K.Y. Tay, A.A.O. Kripesh, V. MECHANICAL ENGINEERING Lead-free composite solders Strain hardening exponent Strain rate 10.1109/EPTC.2009.5416539 Proceedings of the Electronic Packaging Technology Conference, EPTC 272-277 2014-10-07T09:14:02Z 2014-10-07T09:14:02Z 2009 Conference Paper Chandra Rao, B.S.S., Mohan Kumar, K., Zeng, K.Y., Tay, A.A.O., Kripesh, V. (2009). Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders. Proceedings of the Electronic Packaging Technology Conference, EPTC : 272-277. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2009.5416539 9781424451005 http://scholarbank.nus.edu.sg/handle/10635/85944 000288404200046 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| topic |
Lead-free composite solders Strain hardening exponent Strain rate |
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Lead-free composite solders Strain hardening exponent Strain rate Chandra Rao, B.S.S. Mohan Kumar, K. Zeng, K.Y. Tay, A.A.O. Kripesh, V. Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders |
| description |
10.1109/EPTC.2009.5416539 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Chandra Rao, B.S.S. Mohan Kumar, K. Zeng, K.Y. Tay, A.A.O. Kripesh, V. |
| format |
Conference or Workshop Item |
| author |
Chandra Rao, B.S.S. Mohan Kumar, K. Zeng, K.Y. Tay, A.A.O. Kripesh, V. |
| author_sort |
Chandra Rao, B.S.S. |
| title |
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders |
| title_short |
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders |
| title_full |
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders |
| title_fullStr |
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders |
| title_full_unstemmed |
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders |
| title_sort |
effect of strain rate and temperature on tensile flow behavior of snagcu nanocomposite solders |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85944 |
| _version_ |
1781784787082543104 |