Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders

• Main Authors: Chandra Rao, B.S.S., Mohan Kumar, K., Zeng, K.Y., Tay, A.A.O., Kripesh, V.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Lead-free composite solders; Strain hardening exponent; Strain rate
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85944
• Institution: National University of Singapore

10.1109/EPTC.2009.5416539