Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85988
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Institution: National University of Singapore
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Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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