Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Main Authors:	Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85988
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85988
record_format	dspace
spelling	sg-nus-scholar.10635-859882015-01-17T16:32:00Z Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 630-634 2014-10-07T09:14:34Z 2014-10-07T09:14:34Z 2004 Conference Paper Zhang, X.,Tee, T.Y.,Ng, H.S.,Teysseyre, J.,Loo, S.,Mhaisalkar, S.,Ng, F.K.,Lim, C.T.,Du, X.,Bool, E.,Zhu, W.,Chew, S. (2004). Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 630-634. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/85988 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S.
format	Conference or Workshop Item
author	Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S.
spellingShingle	Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S. Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
author_sort	Zhang, X.
title	Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
title_short	Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
title_full	Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
title_fullStr	Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
title_full_unstemmed	Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
title_sort	hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die bga module with molded underfill
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85988
_version_	1681089901343277056

Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

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