Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

• Main Authors: Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85988
• Institution: National University of Singapore

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004