Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
10.1109/ECTC.2006.1645653
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sg-nus-scholar.10635-860802023-10-31T20:14:21Z Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging Mohan Kumar, K. Kripesh, V. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ECTC.2006.1645653 Proceedings - Electronic Components and Technology Conference 2006 237-243 PECCA 2014-10-07T09:15:38Z 2014-10-07T09:15:38Z 2006 Conference Paper Mohan Kumar, K., Kripesh, V., Tay, A.A.O. (2006). Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 237-243. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645653 1424401526 05695503 http://scholarbank.nus.edu.sg/handle/10635/86080 000238566600036 Scopus |
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10.1109/ECTC.2006.1645653 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Mohan Kumar, K. Kripesh, V. Tay, A.A.O. |
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Conference or Workshop Item |
author |
Mohan Kumar, K. Kripesh, V. Tay, A.A.O. |
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Mohan Kumar, K. Kripesh, V. Tay, A.A.O. Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
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Mohan Kumar, K. |
title |
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
title_short |
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
title_full |
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
title_fullStr |
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
title_full_unstemmed |
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
title_sort |
sn-ag-cu lead-free composite solders for ultra-fine-pitch wafer-level packaging |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/86080 |
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1781784801772044288 |