Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging

10.1109/ECTC.2006.1645653

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Bibliographic Details
Main Authors: Mohan Kumar, K., Kripesh, V., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86080
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-860802023-10-31T20:14:21Z Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging Mohan Kumar, K. Kripesh, V. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ECTC.2006.1645653 Proceedings - Electronic Components and Technology Conference 2006 237-243 PECCA 2014-10-07T09:15:38Z 2014-10-07T09:15:38Z 2006 Conference Paper Mohan Kumar, K., Kripesh, V., Tay, A.A.O. (2006). Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 237-243. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645653 1424401526 05695503 http://scholarbank.nus.edu.sg/handle/10635/86080 000238566600036 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/ECTC.2006.1645653
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Mohan Kumar, K.
Kripesh, V.
Tay, A.A.O.
format Conference or Workshop Item
author Mohan Kumar, K.
Kripesh, V.
Tay, A.A.O.
spellingShingle Mohan Kumar, K.
Kripesh, V.
Tay, A.A.O.
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
author_sort Mohan Kumar, K.
title Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
title_short Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
title_full Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
title_fullStr Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
title_full_unstemmed Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
title_sort sn-ag-cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/86080
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