Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging

• Main Authors: Mohan Kumar, K., Kripesh, V., Tay, A.A.O.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/86080
• Institution: National University of Singapore

10.1109/ECTC.2006.1645653