Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication

10.1116/1.1503791

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Bibliographic Details
Main Authors: Sin, C.-Y., Chen, B.-H., Loh, W.L., Yu, J., Yelehanka, P., See, A., Chan, L.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/92306
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-923062023-10-30T21:50:32Z Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication Sin, C.-Y. Chen, B.-H. Loh, W.L. Yu, J. Yelehanka, P. See, A. Chan, L. CHEMICAL & ENVIRONMENTAL ENGINEERING 10.1116/1.1503791 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 20 5 1974-1981 JVTBD 2014-10-09T10:00:05Z 2014-10-09T10:00:05Z 2002-09 Article Sin, C.-Y., Chen, B.-H., Loh, W.L., Yu, J., Yelehanka, P., See, A., Chan, L. (2002-09). Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 20 (5) : 1974-1981. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1503791 10711023 http://scholarbank.nus.edu.sg/handle/10635/92306 000178669200029 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1116/1.1503791
author2 CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet CHEMICAL & ENVIRONMENTAL ENGINEERING
Sin, C.-Y.
Chen, B.-H.
Loh, W.L.
Yu, J.
Yelehanka, P.
See, A.
Chan, L.
format Article
author Sin, C.-Y.
Chen, B.-H.
Loh, W.L.
Yu, J.
Yelehanka, P.
See, A.
Chan, L.
spellingShingle Sin, C.-Y.
Chen, B.-H.
Loh, W.L.
Yu, J.
Yelehanka, P.
See, A.
Chan, L.
Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication
author_sort Sin, C.-Y.
title Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication
title_short Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication
title_full Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication
title_fullStr Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication
title_full_unstemmed Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication
title_sort resist trimming in high-density cf4/o2 plasmas for sub-0.1 μm device fabrication
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/92306
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