Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask

The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etchi...

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Main Authors:	Narongchai Siwarakrangsun, Nithi Atthi, Supanit Porntheeraphat, Jirawat Jantawong, Komgrit Leksakul, Amporn Poyai
格式:	Book Series
出版:	2018
主題:	Engineering
在線閱讀:	https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570
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機構:	Chiang Mai University

id	th-cmuir.6653943832-52570
record_format	dspace
spelling	th-cmuir.6653943832-525702018-09-04T09:27:14Z Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai Engineering The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland. 2018-09-04T09:27:14Z 2018-09-04T09:27:14Z 2013-02-25 Book Series 10226680 2-s2.0-84874043393 10.4028/www.scientific.net/AMR.658.93 https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570
institution	Chiang Mai University
building	Chiang Mai University Library
country	Thailand
collection	CMU Intellectual Repository
topic	Engineering
spellingShingle	Engineering Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
description	The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland.
format	Book Series
author	Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai
author_facet	Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai
author_sort	Narongchai Siwarakrangsun
title	Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_short	Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_full	Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_fullStr	Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_full_unstemmed	Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_sort	fabrication of multi-level photoresist patterns in one-step lithography by using cr/ni multi-film thickness mask
publishDate	2018
url	https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570
_version_	1681423975203209216

Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask

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