Reduction of IC package warpage through finite element analysis and direct optimization
Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was set to predict the warpage of an active metal brazed...
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Main Authors: | , , , , , , |
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Format: | text |
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Animo Repository
2019
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Subjects: | |
Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/55 https://animorepository.dlsu.edu.ph/context/faculty_research/article/1054/type/native/viewcontent |
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Institution: | De La Salle University |