Reduction of IC package warpage through finite element analysis and direct optimization

Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was set to predict the warpage of an active metal brazed...

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Bibliographic Details
Main Authors: Moran, Roberto Louis, Arriola, Emmanuel, Emil Lim, Nino Rigo, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
Format: text
Published: Animo Repository 2019
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Online Access:https://animorepository.dlsu.edu.ph/faculty_research/55
https://animorepository.dlsu.edu.ph/context/faculty_research/article/1054/type/native/viewcontent
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Institution: De La Salle University