Reduction of IC package warpage through finite element analysis and direct optimization

• Main Authors: Moran, Roberto Louis, Arriola, Emmanuel, Emil Lim, Nino Rigo, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
• Format: text
• Published: Animo Repository 2019
• Subjects: Integrated circuits—Packaging; Finite element method; Mechanical Engineering
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/55; https://animorepository.dlsu.edu.ph/context/faculty_research/article/1054/type/native/viewcontent
• Institution: De La Salle University

Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was set to predict the warpage of an active metal brazed...