Design of a heat flux sensor by MEMS technology

• Main Author: Wan, Siew Ping
• Other Authors: Tan, Fock Lai
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing::Product design; DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems
• Online Access: http://hdl.handle.net/10356/13421
• Institution: Nanyang Technological University

The purpose of this report is to look into the design, fabrication and calibration of a heat flux sensor using MEMS technology. MEMS technology is the acronym for microelectromechanical systems, which is a spin-off from the wafer fabrication techniques of the semiconductor industry. This is a system of design and fabrication techniques that works in the dimensional range of micron and sub-micron and it involves expertise in electronic, electrical, chemical, and mechanical field. The micro thermal sensor measuring heat flux is designed based on thermocouple principle and is configured as a large circular thermopile. By using the design and fabrication techniques of MEMS technology, the large thermopile consisting of various thin-film layers can be contain in a small volume, making it possible to have a micro-sensor.