Fabrication & characterization of high aspect ratio fine pitch deep reactive ion etched through-wafer electroplated copper interconnects

In recent years, through-wafer interconnects have emerged as a critical component required in the fabrication of the next generation of 3-D consumer electronic devices, which will have faster signal processing speed, ultra high I/Os density, smaller foot-print area, improved electrical and thermo-me...

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Bibliographic Details
Main Author: Dixit, Pradeep
Other Authors: Miao Jianmin
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/13519
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Institution: Nanyang Technological University
Language: English