Fabrication & characterization of high aspect ratio fine pitch deep reactive ion etched through-wafer electroplated copper interconnects
In recent years, through-wafer interconnects have emerged as a critical component required in the fabrication of the next generation of 3-D consumer electronic devices, which will have faster signal processing speed, ultra high I/Os density, smaller foot-print area, improved electrical and thermo-me...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/13519 |
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| Institution: | Nanyang Technological University |
| Language: | English |