Fabrication & characterization of high aspect ratio fine pitch deep reactive ion etched through-wafer electroplated copper interconnects

• Main Author: Dixit, Pradeep
• Other Authors: Miao Jianmin
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: https://hdl.handle.net/10356/13519
• Institution: Nanyang Technological University

In recent years, through-wafer interconnects have emerged as a critical component required in the fabrication of the next generation of 3-D consumer electronic devices, which will have faster signal processing speed, ultra high I/Os density, smaller foot-print area, improved electrical and thermo-me...