Evaluation of fan-out wafer level package strength

• المؤلفون الرئيسيون: Xu, Cheng, Zhong, Zhao-Wei, Choi, Won-kyoung
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2021
• الموضوعات: Engineering::Mechanical engineering; Advanced Packaging; Fan-out Wafer Level Package
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/150234

Purpose: The fan-out wafer level package (FOWLP) becomes more and more attractive and popular because of its flexibility to integrate diverse devices into a very small form factor. The strength of ultrathin FOWLP is low, and the low package strength often leads to crack issues. This paper aims to st...