Evaluation of fan-out wafer level package strength

Purpose: The fan-out wafer level package (FOWLP) becomes more and more attractive and popular because of its flexibility to integrate diverse devices into a very small form factor. The strength of ultrathin FOWLP is low, and the low package strength often leads to crack issues. This paper aims to st...

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Bibliographic Details
Main Authors: Xu, Cheng, Zhong, Zhao-Wei, Choi, Won-kyoung
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2021
Subjects:
Online Access:https://hdl.handle.net/10356/150234
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Institution: Nanyang Technological University
Language: English

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