Large-scale fabrication of surface ion traps on a 300 mm glass wafer

• Main Authors: Tao, Jing, Likforman, Jean-Pierre, Zhao, Peng, Li, Hong Yu, Henner, Theo, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2022
• Subjects: Engineering::Electrical and electronic engineering; Glass Ion Traps; Large-Scale Fabrication
• Online Access: https://hdl.handle.net/10356/160357
• Institution: Nanyang Technological University

Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer substrate. A trap is tested by loading it with laser-cooled 88Sr+ ions. The trap shows a stable operation with RF amplitudes in the range of 100–250 V at 33 MHz frequency. The ion lifetime is on the order of 30 min with laser cooling with a vacuum chamber pressure of ≈5 × 10−11 mbar. These results demonstrate the potential of large-size foundry glass substrates to realize scalable and integratable trapped ion-based quantum devices.