Large-scale fabrication of surface ion traps on a 300 mm glass wafer

Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer subst...

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Bibliographic Details
Main Authors: Tao, Jing, Likforman, Jean-Pierre, Zhao, Peng, Li, Hong Yu, Henner, Theo, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2022
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Online Access:https://hdl.handle.net/10356/160357
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Institution: Nanyang Technological University
Language: English