Large-scale fabrication of surface ion traps on a 300 mm glass wafer
Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer subst...
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Main Authors: | Tao, Jing, Likforman, Jean-Pierre, Zhao, Peng, Li, Hong Yu, Henner, Theo, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Article |
Language: | English |
Published: |
2022
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/160357 |
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Institution: | Nanyang Technological University |
Language: | English |
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