Characterization and modeling of on-wafer interconnects for RFICs

• المؤلف الرئيسي: Shi, Xiaomeng
• مؤلفون آخرون: Yeo Kiat Seng
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/3506
• المؤسسة: Nanyang Technological University

This thesis addresses the characterization and modeling of on-wafer interconnects for CMOS RFICs. A scalable equivalent circuit model for complex-shaped interconnects is proposed. In this proposed structure, frequency-variant characteristics are modeled by frequency independent components. Therefore...