Study of microstructures and mechanical properties of lead-free solder joints
220 p.
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Main Author: | Ngoh, Shwu Lan |
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Other Authors: | Pang Hock Lye, John |
Format: | Theses and Dissertations |
Published: |
2010
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/36000 |
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Institution: | Nanyang Technological University |
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