Study of microstructures and mechanical properties of lead-free solder joints

220 p.

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Bibliographic Details
Main Author: Ngoh, Shwu Lan
Other Authors: Pang Hock Lye, John
Format: Theses and Dissertations
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/36000
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Institution: Nanyang Technological University

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