Characteristics of chemical mechanical polishing in advanced wafer processing

Characteristics of chemical mechanical polishing in advanced wafer processing

Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization to meet the requirement of photolithography to build multi-level interconnection layers. It is the best planarization method because of its ability to get longer length scales than traditional planar...

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Main Author: Huang, Wen Ke.
Other Authors: Prasad, Krishnamachar
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Online Access:http://hdl.handle.net/10356/4399
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-43992023-07-04T15:57:13Z Characteristics of chemical mechanical polishing in advanced wafer processing Huang, Wen Ke. Prasad, Krishnamachar School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization to meet the requirement of photolithography to build multi-level interconnection layers. It is the best planarization method because of its ability to get longer length scales than traditional planar techniques. Master of Science (Microelectronics) 2008-09-17T09:50:44Z 2008-09-17T09:50:44Z 2003 2003 Thesis http://hdl.handle.net/10356/4399 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Huang, Wen Ke.
Characteristics of chemical mechanical polishing in advanced wafer processing
description Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization to meet the requirement of photolithography to build multi-level interconnection layers. It is the best planarization method because of its ability to get longer length scales than traditional planar techniques.
author2 Prasad, Krishnamachar
author_facet Prasad, Krishnamachar
Huang, Wen Ke.
format Theses and Dissertations
author Huang, Wen Ke.
author_sort Huang, Wen Ke.
title Characteristics of chemical mechanical polishing in advanced wafer processing
title_short Characteristics of chemical mechanical polishing in advanced wafer processing
title_full Characteristics of chemical mechanical polishing in advanced wafer processing
title_fullStr Characteristics of chemical mechanical polishing in advanced wafer processing
title_full_unstemmed Characteristics of chemical mechanical polishing in advanced wafer processing
title_sort characteristics of chemical mechanical polishing in advanced wafer processing
publishDate 2008
url http://hdl.handle.net/10356/4399
_version_ 1772826381300793344

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