Characteristics of chemical mechanical polishing in advanced wafer processing
Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization to meet the requirement of photolithography to build multi-level interconnection layers. It is the best planarization method because of its ability to get longer length scales than traditional planar...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/4399 |
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| Institution: | Nanyang Technological University |