Characteristics of chemical mechanical polishing in advanced wafer processing

• Main Author: Huang, Wen Ke.
• Other Authors: Prasad, Krishnamachar
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• Online Access: http://hdl.handle.net/10356/4399
• Institution: Nanyang Technological University

Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization to meet the requirement of photolithography to build multi-level interconnection layers. It is the best planarization method because of its ability to get longer length scales than traditional planar...