An investigation on flip chip underfill delamination
Flip chip technology provides advantages of shorter possible leads, lower inductance, higher frequency, better noise control, higher density, greater input / output (I/O), smaller device footprints, and lower profile comparably with conventional wire bond technology or face-up TAB technology. These...
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/6106 |
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| 機構: | Nanyang Technological University |