An investigation on flip chip underfill delamination

• Main Author: Lee, Bryan Sik Pong.
• Other Authors: School of Mechanical and Production Engineering
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/6106
• Institution: Nanyang Technological University

Flip chip technology provides advantages of shorter possible leads, lower inductance, higher frequency, better noise control, higher density, greater input / output (I/O), smaller device footprints, and lower profile comparably with conventional wire bond technology or face-up TAB technology. These...