An investigation on flip chip underfill delamination

An investigation on flip chip underfill delamination

Flip chip technology provides advantages of shorter possible leads, lower inductance, higher frequency, better noise control, higher density, greater input / output (I/O), smaller device footprints, and lower profile comparably with conventional wire bond technology or face-up TAB technology. These...

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書目詳細資料
主要作者:	Lee, Bryan Sik Pong.
其他作者:	School of Mechanical and Production Engineering
格式:	Theses and Dissertations
出版:	2008
主題:	DRNTU::Engineering::Manufacturing
在線閱讀:	http://hdl.handle.net/10356/6106
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University

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