An investigation on flip chip underfill delamination

• المؤلف الرئيسي: Lee, Bryan Sik Pong.
• مؤلفون آخرون: School of Mechanical and Production Engineering
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/6106
• المؤسسة: Nanyang Technological University

Flip chip technology provides advantages of shorter possible leads, lower inductance, higher frequency, better noise control, higher density, greater input / output (I/O), smaller device footprints, and lower profile comparably with conventional wire bond technology or face-up TAB technology. These...