Polishing and planarization of polymeric materials for MEMS applications
In this dissertation, the CMP process on polycarbonate and PMMA blanket substrates were investigated. Initially, four types of slurries were tested on these samples under the same CMP process condition. Slurry with the lowest surface roughness was then chosen and together with variation in process p...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6501 |
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| Institution: | Nanyang Technological University |
| Summary: | In this dissertation, the CMP process on polycarbonate and PMMA blanket substrates were investigated. Initially, four types of slurries were tested on these samples under the same CMP process condition. Slurry with the lowest surface roughness was then chosen and together with variation in process parameters. The experimental results show impacts of CMP process parameters on the removal rate and surface roughness of polycarbonate and PMMA substrate. |
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