Polishing and planarization of polymeric materials for MEMS applications

Polishing and planarization of polymeric materials for MEMS applications

In this dissertation, the CMP process on polycarbonate and PMMA blanket substrates were investigated. Initially, four types of slurries were tested on these samples under the same CMP process condition. Slurry with the lowest surface roughness was then chosen and together with variation in process p...

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Main Author: Tan, Yew Heng.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems
Online Access:http://hdl.handle.net/10356/6501
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-65012023-03-11T17:40:55Z Polishing and planarization of polymeric materials for MEMS applications Tan, Yew Heng. Zhong, Zhaowei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems In this dissertation, the CMP process on polycarbonate and PMMA blanket substrates were investigated. Initially, four types of slurries were tested on these samples under the same CMP process condition. Slurry with the lowest surface roughness was then chosen and together with variation in process parameters. The experimental results show impacts of CMP process parameters on the removal rate and surface roughness of polycarbonate and PMMA substrate. Master of Science (Precision Engineering) 2008-09-17T11:16:35Z 2008-09-17T11:16:35Z 2005 2005 Thesis http://hdl.handle.net/10356/6501 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems
Tan, Yew Heng.
Polishing and planarization of polymeric materials for MEMS applications
description In this dissertation, the CMP process on polycarbonate and PMMA blanket substrates were investigated. Initially, four types of slurries were tested on these samples under the same CMP process condition. Slurry with the lowest surface roughness was then chosen and together with variation in process parameters. The experimental results show impacts of CMP process parameters on the removal rate and surface roughness of polycarbonate and PMMA substrate.
author2 Zhong, Zhaowei
author_facet Zhong, Zhaowei
Tan, Yew Heng.
format Theses and Dissertations
author Tan, Yew Heng.
author_sort Tan, Yew Heng.
title Polishing and planarization of polymeric materials for MEMS applications
title_short Polishing and planarization of polymeric materials for MEMS applications
title_full Polishing and planarization of polymeric materials for MEMS applications
title_fullStr Polishing and planarization of polymeric materials for MEMS applications
title_full_unstemmed Polishing and planarization of polymeric materials for MEMS applications
title_sort polishing and planarization of polymeric materials for mems applications
publishDate 2008
url http://hdl.handle.net/10356/6501
_version_ 1761781979326447616

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