Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packag...

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Main Author: Tee, Tong Yan
Other Authors: Zhong Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Product engineering
Online Access:https://hdl.handle.net/10356/6512
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-65122023-03-11T17:45:52Z Package and board level reliability modeling of advanced CSP pakages for telecommunication applications Tee, Tong Yan Zhong Zhaowei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Product engineering Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). However, due to limited product development time, these CSPs are usually not tested and studied in detail before introduction to the market. As a result, the package design may not be optimized for various reliability requirements, e.g., popcorn, thermal cycling test, and drop test. DOCTOR OF PHILOSOPHY (MAE) 2008-09-17T11:16:55Z 2008-09-17T11:16:55Z 2005 2005 Thesis Tee, T. Y. (2005). Package and board level reliability modeling of advanced CSP pakages for telecommunication applications. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/6512 10.32657/10356/6512 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing::Product engineering
spellingShingle DRNTU::Engineering::Manufacturing::Product engineering
Tee, Tong Yan
Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
description Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). However, due to limited product development time, these CSPs are usually not tested and studied in detail before introduction to the market. As a result, the package design may not be optimized for various reliability requirements, e.g., popcorn, thermal cycling test, and drop test.
author2 Zhong Zhaowei
author_facet Zhong Zhaowei
Tee, Tong Yan
format Theses and Dissertations
author Tee, Tong Yan
author_sort Tee, Tong Yan
title Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
title_short Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
title_full Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
title_fullStr Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
title_full_unstemmed Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
title_sort package and board level reliability modeling of advanced csp pakages for telecommunication applications
publishDate 2008
url https://hdl.handle.net/10356/6512
_version_ 1761782081000570880

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