Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

• Main Author: Tee, Tong Yan
• Other Authors: Zhong Zhaowei
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing::Product engineering
• Online Access: https://hdl.handle.net/10356/6512
• Institution: Nanyang Technological University

Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packag...