Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

• المؤلف الرئيسي: Tee, Tong Yan
• مؤلفون آخرون: Zhong Zhaowei
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing::Product engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/6512
• المؤسسة: Nanyang Technological University

Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packag...