Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization
(Ni-P and Ni-W-P) were developed as the soldering metallization in this work to solve the potential reliability. The interfacial reactions between lead-free Sn-3.5Ag solder and these ternary metallizations during reflow and thermal aging were investigated. The interfacial reaction between the same s...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2016
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| 在線閱讀: | https://hdl.handle.net/10356/68911 |
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