Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization

• Main Author: Zhang, Keran
• Other Authors: Huang Yizhong
• Format: Theses and Dissertations
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/68911
• Institution: Nanyang Technological University

(Ni-P and Ni-W-P) were developed as the soldering metallization in this work to solve the potential reliability. The interfacial reactions between lead-free Sn-3.5Ag solder and these ternary metallizations during reflow and thermal aging were investigated. The interfacial reaction between the same s...