Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization

(Ni-P and Ni-W-P) were developed as the soldering metallization in this work to solve the potential reliability. The interfacial reactions between lead-free Sn-3.5Ag solder and these ternary metallizations during reflow and thermal aging were investigated. The interfacial reaction between the same s...

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Bibliographic Details
Main Author: Zhang, Keran
Other Authors: Huang Yizhong
Format: Theses and Dissertations
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/68911
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Institution: Nanyang Technological University
Language: English