Growth of CNTs on graphene for future 3D-IC
This project is a part of a research project to realise a combined Graphene and CNTs interconnect to replace copper based interconnect for 3D Integrated Circuit. Graphene and CNTs have shown potential to be a replacement of copper interconnect, which suffer increase of resistivity for dimension belo...
Saved in:
Main Author: | Hagi, Theodore |
---|---|
Other Authors: | Tay Beng Kang |
Format: | Final Year Project |
Language: | English |
Published: |
2017
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/71827 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties
by: Ghosh, K., et al.
Published: (2016) -
Growth and characterization of PECVD growth CNTs and CNT networks
by: Tay, Roland Yingjie.
Published: (2009) -
Study on the growth parameters of CNTs for lithium ion battery application
by: Gao, Li
Published: (2014) -
3D circuit model for 3D IC reliability study
by: Tan, Cher Ming, et al.
Published: (2010) -
Advanced wafer bonding for substrate engineering and 3D IC integration
by: Chong, Gang Yih
Published: (2014)