Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

• المؤلفون الرئيسيون: He, Min, Lau, Wee Hua, Qi, Guojun, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94359; http://hdl.handle.net/10220/8208
• المؤسسة: Nanyang Technological University

Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Ni-based under bump metallization (UBM) therefore receives considerable attention from the microelectronic packaging industry for the popular flipchip applications. In this work, we study the interfacial reaction of elect...