Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Ni-based under bump metallization (UBM) therefore receives considerable attention from the microelectronic packaging industry for the popular flipchip applications. In this work, we study the interfacial reaction of elect...
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Main Authors: | , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2012
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/94359 http://hdl.handle.net/10220/8208 |
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Institution: | Nanyang Technological University |
Language: | English |
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