Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

Thermal aging is one of the accelerated tests for IC package reliability during manufacturing processes and under actual usage conditions. During the process of thermal aging, intermetallic compounds (IMC) grow continuously due to element diffusion, resulting in their morphology change and thickness...

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Main Authors: He, Min, Chen, Zhong, Qi, Guojun
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/94805
http://hdl.handle.net/10220/8150
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-948052023-07-14T15:53:15Z Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization He, Min Chen, Zhong Qi, Guojun School of Materials Science & Engineering DRNTU::Engineering::Materials Thermal aging is one of the accelerated tests for IC package reliability during manufacturing processes and under actual usage conditions. During the process of thermal aging, intermetallic compounds (IMC) grow continuously due to element diffusion, resulting in their morphology change and thickness increase. In this work, the solid state reaction between electroless Ni–P and two types of Sn-based solders (Sn–3.5Ag and Sn–37Pb) has been investigated. Three distinctive layers, Ni3Sn4, NiSnP and Ni3P, were found between the Sn-containing solders and Ni–P under bump metallization. The growth rates of Ni3Sn4 IMC at different temperatures were obtained from the aged samples and the activation energy of Ni3Sn4 growth was estimated. The kinetic data obtained show that the Ni3Sn4 in the Sn–3.5Ag/Ni–P joints grows much faster than with the Sn–37Pb solder under the same condition. Kirkendall voids are found inside the Ni3P layer after thermal aging. The void formation mechanism is due to net Ni out-flux into the solder area. Accepted version 2012-05-28T05:56:00Z 2019-12-06T19:02:36Z 2012-05-28T05:56:00Z 2019-12-06T19:02:36Z 2004 2004 Journal Article He, M., Chen, Z., & Qi, G. (2004). Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Materialia, 52(7), 2047-2056. https://hdl.handle.net/10356/94805 http://hdl.handle.net/10220/8150 10.1016/j.actamat.2003.12.042 en Acta materialia 2004 Acta Materialia Inc. This is the author created version of a work that has been peer reviewed and accepted for publication in Acta Materialia, published by Elsevier on behalf of Acta Materialia Inc.  It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document.  The published version is available at: [http://dx.doi.org/10.1016/j.actamat.2003.12.042]. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
He, Min
Chen, Zhong
Qi, Guojun
Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
description Thermal aging is one of the accelerated tests for IC package reliability during manufacturing processes and under actual usage conditions. During the process of thermal aging, intermetallic compounds (IMC) grow continuously due to element diffusion, resulting in their morphology change and thickness increase. In this work, the solid state reaction between electroless Ni–P and two types of Sn-based solders (Sn–3.5Ag and Sn–37Pb) has been investigated. Three distinctive layers, Ni3Sn4, NiSnP and Ni3P, were found between the Sn-containing solders and Ni–P under bump metallization. The growth rates of Ni3Sn4 IMC at different temperatures were obtained from the aged samples and the activation energy of Ni3Sn4 growth was estimated. The kinetic data obtained show that the Ni3Sn4 in the Sn–3.5Ag/Ni–P joints grows much faster than with the Sn–37Pb solder under the same condition. Kirkendall voids are found inside the Ni3P layer after thermal aging. The void formation mechanism is due to net Ni out-flux into the solder area.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
He, Min
Chen, Zhong
Qi, Guojun
format Article
author He, Min
Chen, Zhong
Qi, Guojun
author_sort He, Min
title Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
title_short Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
title_full Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
title_fullStr Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
title_full_unstemmed Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
title_sort solid state interfacial reaction of sn–37pb and sn–3.5ag solders with ni–p under bump metallization
publishDate 2012
url https://hdl.handle.net/10356/94805
http://hdl.handle.net/10220/8150
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