Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

• Main Authors: He, Min, Chen, Zhong, Qi, Guojun
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2012
• 主題: DRNTU::Engineering::Materials
• 在線閱讀: https://hdl.handle.net/10356/94805; http://hdl.handle.net/10220/8150

Thermal aging is one of the accelerated tests for IC package reliability during manufacturing processes and under actual usage conditions. During the process of thermal aging, intermetallic compounds (IMC) grow continuously due to element diffusion, resulting in their morphology change and thickness...