Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process

Titanium silicon nitride (Ti–Si–N) has emerged as a strong candidate for next generation diffusion barrier material in copper/low-k dielectric back-end-of-line device fabrication. Low frequency, high density inductively coupled plasma process has been developed for the growth of Ti–Si–N film. This w...

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Main Authors: Rutkevych, P. P., Zeng, K. Y., Chen, Z., Chan, L., See, K. H., Law, S. B., Xu, S., Tsakadze, Z. L., Shen, L., Ee, Elden Yong Chiang
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/94919
http://hdl.handle.net/10220/7695
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-949192023-07-14T15:44:42Z Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process Rutkevych, P. P. Zeng, K. Y. Chen, Z. Chan, L. See, K. H. Law, S. B. Xu, S. Tsakadze, Z. L. Shen, L. Ee, Elden Yong Chiang School of Materials Science & Engineering DRNTU::Engineering::Materials Titanium silicon nitride (Ti–Si–N) has emerged as a strong candidate for next generation diffusion barrier material in copper/low-k dielectric back-end-of-line device fabrication. Low frequency, high density inductively coupled plasma process has been developed for the growth of Ti–Si–N film. This work employs the reaction between TixSiy and the nitrogen plasma. Ti–Si–N films have been successfully grown over different process conditions. Film properties were characterized by Rutherford backscattering spectrometry (RBS), x-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectroscopy, x-ray diffraction (XRD), and four-point resistivity probe. RBS reveals that 2–67 at. % of nitrogen can be achieved through the implantation of nitrogen in TixSiy film. XPS and XRD results show that TiN and Si3N4 are successfully formed. As the external bias increases from 100 to 300 V, there is an 80% increase in sheet resistance. Other process conditions investigated do not show a significant effect on film sheet resistance. Increasing argon plasma activation time can significantly increase the implantation depth of nitrogen into TixSiy substrate. Published version 2012-04-09T04:09:09Z 2019-12-06T19:04:41Z 2012-04-09T04:09:09Z 2019-12-06T19:04:41Z 2005 2005 Journal Article Ee, E. Y. C., Chen, Z., Chan, L., See, K. H., Law, S. B., Xu, S., et al. (2005). Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process. Journal of vacuum science & technology B, 23, 2444-2448. https://hdl.handle.net/10356/94919 http://hdl.handle.net/10220/7695 10.1116/1.2131080 en Journal of vacuum science & technology B © 2005 American Vacuum Society This paper was published in Journal of Vacuum Science & Technology B and is made available as an electronic reprint (preprint) with permission of American Vacuum Society. The paper can be found at the following official URL: http://dx.doi.org/10.1116/1.2131080. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. 5 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Rutkevych, P. P.
Zeng, K. Y.
Chen, Z.
Chan, L.
See, K. H.
Law, S. B.
Xu, S.
Tsakadze, Z. L.
Shen, L.
Ee, Elden Yong Chiang
Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process
description Titanium silicon nitride (Ti–Si–N) has emerged as a strong candidate for next generation diffusion barrier material in copper/low-k dielectric back-end-of-line device fabrication. Low frequency, high density inductively coupled plasma process has been developed for the growth of Ti–Si–N film. This work employs the reaction between TixSiy and the nitrogen plasma. Ti–Si–N films have been successfully grown over different process conditions. Film properties were characterized by Rutherford backscattering spectrometry (RBS), x-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectroscopy, x-ray diffraction (XRD), and four-point resistivity probe. RBS reveals that 2–67 at. % of nitrogen can be achieved through the implantation of nitrogen in TixSiy film. XPS and XRD results show that TiN and Si3N4 are successfully formed. As the external bias increases from 100 to 300 V, there is an 80% increase in sheet resistance. Other process conditions investigated do not show a significant effect on film sheet resistance. Increasing argon plasma activation time can significantly increase the implantation depth of nitrogen into TixSiy substrate.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Rutkevych, P. P.
Zeng, K. Y.
Chen, Z.
Chan, L.
See, K. H.
Law, S. B.
Xu, S.
Tsakadze, Z. L.
Shen, L.
Ee, Elden Yong Chiang
format Article
author Rutkevych, P. P.
Zeng, K. Y.
Chen, Z.
Chan, L.
See, K. H.
Law, S. B.
Xu, S.
Tsakadze, Z. L.
Shen, L.
Ee, Elden Yong Chiang
author_sort Rutkevych, P. P.
title Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process
title_short Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process
title_full Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process
title_fullStr Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process
title_full_unstemmed Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process
title_sort formation of ti-si-n film using low frequency, high density inductively coupled plasma process
publishDate 2012
url https://hdl.handle.net/10356/94919
http://hdl.handle.net/10220/7695
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