Evolution of surface roughness during metal silicides phase transformation

This study monitors systematically the evolution of surface roughness during metal (Ti, Co, and Ni) silicides phase transformation and coupling to other physical parameters. During metal/silicon reaction film surface roughness evolves due to the effect of nucleation and growth of metal silicides and...

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Main Authors: Pang, C. H., Hing, P., Zhao, F. F., See, A., Chong, Y. F., Lee, Pooi See
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/94996
http://hdl.handle.net/10220/8699
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-949962023-07-14T15:53:31Z Evolution of surface roughness during metal silicides phase transformation Pang, C. H. Hing, P. Zhao, F. F. See, A. Chong, Y. F. Lee, Pooi See School of Materials Science & Engineering DRNTU::Engineering::Materials This study monitors systematically the evolution of surface roughness during metal (Ti, Co, and Ni) silicides phase transformation and coupling to other physical parameters. During metal/silicon reaction film surface roughness evolves due to the effect of nucleation and growth of metal silicides and is sensitive to different processing conditions. In general, surface roughness increases as new phases are formed and decreases during grain growth. The difference in roughness between processes indicates whether a process is more inferior for new phase formation. The correlation of surface roughness towards sheet resistance, film thickness, and phase transformation are found to be independent of film thickness in C49-to-C54 TiSi2 polymorphic transformation but not for Co and Ni silicides. Any abnormalities from the trend indicate that the film is experiencing a physical degradation. Published version 2012-10-03T08:17:49Z 2019-12-06T19:06:07Z 2012-10-03T08:17:49Z 2019-12-06T19:06:07Z 2004 2004 Journal Article Pang, C. H., Hing, P., Zhao, F. F., See, A., Chong, Y. F., & Lee, P. S. (2004). Evolution of surface roughness during metal silicides phase transformation. Journal of Vacuum Science & Technology A, 22(1), 122-128. 0734-2101 https://hdl.handle.net/10356/94996 http://hdl.handle.net/10220/8699 10.1116/1.1636158 en Journal of vacuum science & technology A © 2004 American Vacuum Society. This paper was published in Journal of Vacuum Science & Technology A and is made available as an electronic reprint (preprint) with permission of American Vacuum Society. The paper can be found at DOI: [http://dx.doi.org/10.1116/1.1636158 ].  One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Pang, C. H.
Hing, P.
Zhao, F. F.
See, A.
Chong, Y. F.
Lee, Pooi See
Evolution of surface roughness during metal silicides phase transformation
description This study monitors systematically the evolution of surface roughness during metal (Ti, Co, and Ni) silicides phase transformation and coupling to other physical parameters. During metal/silicon reaction film surface roughness evolves due to the effect of nucleation and growth of metal silicides and is sensitive to different processing conditions. In general, surface roughness increases as new phases are formed and decreases during grain growth. The difference in roughness between processes indicates whether a process is more inferior for new phase formation. The correlation of surface roughness towards sheet resistance, film thickness, and phase transformation are found to be independent of film thickness in C49-to-C54 TiSi2 polymorphic transformation but not for Co and Ni silicides. Any abnormalities from the trend indicate that the film is experiencing a physical degradation.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Pang, C. H.
Hing, P.
Zhao, F. F.
See, A.
Chong, Y. F.
Lee, Pooi See
format Article
author Pang, C. H.
Hing, P.
Zhao, F. F.
See, A.
Chong, Y. F.
Lee, Pooi See
author_sort Pang, C. H.
title Evolution of surface roughness during metal silicides phase transformation
title_short Evolution of surface roughness during metal silicides phase transformation
title_full Evolution of surface roughness during metal silicides phase transformation
title_fullStr Evolution of surface roughness during metal silicides phase transformation
title_full_unstemmed Evolution of surface roughness during metal silicides phase transformation
title_sort evolution of surface roughness during metal silicides phase transformation
publishDate 2012
url https://hdl.handle.net/10356/94996
http://hdl.handle.net/10220/8699
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