Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay

Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay

Based on the 2011 ITRS road map, the greater accessibility of higher number of TSVs in a specified area depends on the smarter miniaturization of the interconnect dimension in 3D IC packaging. Scaling down the TSV dimension has an inevitable effect on resistance, capacitance, signal transmission as...

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Main Authors: Zhang, J., Zhang, L., Dong, Y., Li, H. Y., Ghosh, Kaushik, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Conference or Workshop Item
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/98846
http://hdl.handle.net/10220/12742
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-988462020-03-07T13:24:49Z Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay Zhang, J. Zhang, L. Dong, Y. Li, H. Y. Ghosh, Kaushik Tan, Cher Ming Xia, Guangrui Tan, Chuan Seng School of Electrical and Electronic Engineering International Microsystems, Packaging, Assembly and Circuits Technology Conference (7th : 2012 : Taipei, Taiwan) Based on the 2011 ITRS road map, the greater accessibility of higher number of TSVs in a specified area depends on the smarter miniaturization of the interconnect dimension in 3D IC packaging. Scaling down the TSV dimension has an inevitable effect on resistance, capacitance, signal transmission as well as the thermo-mechanical stress. We report that the lowering of the TSV diameter is permissible under thermo-mechanical stress consideration. However, the signal transmission delay explodes rapidly and could be tunable via controlling the liner layer capacitance or/and using alternative filler materials. 2013-08-01T03:31:33Z 2019-12-06T20:00:15Z 2013-08-01T03:31:33Z 2019-12-06T20:00:15Z 2012 2012 Conference Paper Ghosh, K., Zhang, J., Zhang, L., Dong, Y., Li, H., Tan, C. M., Xia, G., & Tan, C. S. (2012). Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay. 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 49 - 51. https://hdl.handle.net/10356/98846 http://hdl.handle.net/10220/12742 10.1109/IMPACT.2012.6420220 en
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
description Based on the 2011 ITRS road map, the greater accessibility of higher number of TSVs in a specified area depends on the smarter miniaturization of the interconnect dimension in 3D IC packaging. Scaling down the TSV dimension has an inevitable effect on resistance, capacitance, signal transmission as well as the thermo-mechanical stress. We report that the lowering of the TSV diameter is permissible under thermo-mechanical stress consideration. However, the signal transmission delay explodes rapidly and could be tunable via controlling the liner layer capacitance or/and using alternative filler materials.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Zhang, J.
Zhang, L.
Dong, Y.
Li, H. Y.
Ghosh, Kaushik
Tan, Cher Ming
Xia, Guangrui
Tan, Chuan Seng
format Conference or Workshop Item
author Zhang, J.
Zhang, L.
Dong, Y.
Li, H. Y.
Ghosh, Kaushik
Tan, Cher Ming
Xia, Guangrui
Tan, Chuan Seng
spellingShingle Zhang, J.
Zhang, L.
Dong, Y.
Li, H. Y.
Ghosh, Kaushik
Tan, Cher Ming
Xia, Guangrui
Tan, Chuan Seng
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
author_sort Zhang, J.
title Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
title_short Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
title_full Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
title_fullStr Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
title_full_unstemmed Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
title_sort strategy for tsv scaling with consideration on thermo-mechanical stress and acceptable delay
publishDate 2013
url https://hdl.handle.net/10356/98846
http://hdl.handle.net/10220/12742
_version_ 1681034313016016896

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