FIB precision TEM sample preparation using carbon replica
Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA
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Main Authors: | Sheng, T.T., Goh, G.P., Tung, C.H., Wang, John L.F., Cheng, Jeng Kou |
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其他作者: | INSTITUTE OF MICROELECTRONICS |
格式: | Conference or Workshop Item |
出版: |
2014
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在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/112977 |
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