Analysis of column interconnects for wafer level packages

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Bibliographic Details
Main Author:	SUN WEI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/15222
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-15222
record_format	dspace
spelling	sg-nus-scholar.10635-152222015-01-08T14:43:45Z Analysis of column interconnects for wafer level packages SUN WEI MECHANICAL ENGINEERING TAY AH ONG, ANDREW SRIKANTH VEDANTAM interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging Master's MASTER OF ENGINEERING 2010-04-08T10:51:16Z 2010-04-08T10:51:16Z 2006-03-21 Thesis SUN WEI (2006-03-21). Analysis of column interconnects for wafer level packages. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/15222 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging
spellingShingle	interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging SUN WEI Analysis of column interconnects for wafer level packages
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING SUN WEI
format	Theses and Dissertations
author	SUN WEI
author_sort	SUN WEI
title	Analysis of column interconnects for wafer level packages
title_short	Analysis of column interconnects for wafer level packages
title_full	Analysis of column interconnects for wafer level packages
title_fullStr	Analysis of column interconnects for wafer level packages
title_full_unstemmed	Analysis of column interconnects for wafer level packages
title_sort	analysis of column interconnects for wafer level packages
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/15222
_version_	1681079158472441856

Analysis of column interconnects for wafer level packages

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