Analysis of column interconnects for wafer level packages

Master's

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Bibliographic Details
Main Author:	SUN WEI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/15222
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Institution:	National University of Singapore
Language:	English

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