Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

10.1063/1.4936941

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書目詳細資料
Main Authors:	Wang, D.D, Huang, Y.M, Tan, P.K, Feng, H, Low, G.R, Yap, H.H, He, R, Tan, H, Dawood, M.K, Zhao, Y.Z, Lam, J, Mai, Z.H
其他作者:	ELECTRICAL AND COMPUTER ENGINEERING
格式:	Article
出版:	2020
主題:	Failure analysis Image segmentation Ion beams Semiconductor device manufacture Capture images Chemical etching Focused ion beam technique High-precision Layer peeling Region of interest Semiconductor manufacturing process Technology improvement Polishing
在線閱讀:	https://scholarbank.nus.edu.sg/handle/10635/183737
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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